Revasum | Home| Semiconductor Grinding Technology
Revasum offers a portfolio of marketleading wafer processing equipment. We provide premiere CMP, grinding and substrate manufacturing equipment to critical growth markets including silicon, power, RF communications, LED, MEMS, semiconductor and other mobile applications. Each of Revasum''s products is designed with the customer in mind.
LaserLinc About LaserLinc
LaserLinc specializes in laser and ultrasonic technology for precision measurement of diameter, ovality (also called roundness or eccentricity) Ovality Eccentricity is sometimes used as a measure of the degree to which two forms share a common center, as in an insulated wire where the core (the wire) and the outer insulation do not share the same center.
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